Mao Yi-Chao,Hung Jui-Pin,Lin Jing-Cheng,Jeng Shin-Puu,Yu Chen-Hua
申请号：
US201113290879
公开号：
US9960088(B2)
申请日:
2011.11.07
申请国别(地区):
美国
年份:
2018
代理人:
Slater Matsil, LLP
摘要：
A method for performing grinding includes selecting a target wheel loading for wafer grinding processes, and performing a grinding process on a wafer. With the proceeding of the grinding process, wheel loadings of the grinding process are measured. The grinding process is stopped after the target wheel loading is reached. The method alternatively includes selecting a target reflectivity of wafer grinding processes, and performing a grinding process on a wafer. With a proceeding of the grinding process, reflectivities of a light reflected from a surface of the wafer are measured. The grinding process is stopped after one of the reflectivities reaches the target reflectivity.
