A method for bonding a hermetic module to an electrode array including the steps of: providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate； attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads wherein each bond-pad is adjacent to the bottom surface of the electrode array and aligns with a respective pad； drill holes through each pad to the corresponding bond-pad； filling each hole with biocompatible conductive ink； forming a rivet on the biocompatible conductive ink over each pad； and overmolding the electrode array with a moisture barrier material.
