An implant and method for applying an osteoconductive coating on a non-conductive surface of an implant. The method includes depositing an electroconductive interlayer on at least a portion of a non-conductive implant surface. A secondary process is applied to the interlayer and an osteoconductive coating is thereby formed on the implant. In various embodiments, the electroconductive interlayer is deposited as a non-structural film and comprises a dense, non-porous metal such as titanium, titanium alloys, cobalt, cobalt alloys, chromium, chromium alloys, tantalum, tantalum alloys, iron alloys, stainless steel, and mixtures thereof. The osteoconductive coating may include a metal, a porous metal, or calcium phosphate. The osteoconductive coating may include additional agents, such as bone product, growth factor, bioactive agent, antibiotic, or combinations thereof.
