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PAINLESS AND PATCHLESS SHOOTING MICROSTRUCTURE
专利权人:
发明人:
申请号:
EP14814569.1
公开号:
EP3040100A1
申请日:
2014.06.17
申请国别(地区):
EP
年份:
2016
代理人:
摘要:
The present invention relates to a painless and patchless shooting microstructure, and a microstructure shooting device. According to the present invention, it is possible to inject a microstructure into the skin within the time of less than one second, and the inconvenience of waiting for the decomposition of a microstructure and removing a patch are completely overcome. A patch-type conventional technology has a problem wherein it is difficult to be applied to a region having hair, but the present invention completely overcomes this problem. According to the present invention, it is possible to precisely control the permeation depth of a microstructure into the skin by controlling discharge power.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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