Packing Coil

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专利权人:

MicroVention; Inc.

发明人:

Jake Le,Heath Bowman

申请号：

US16380917

公开号：

US20190231360A1

申请日:

2019.04.10

申请国别(地区):

US

年份:

2019

代理人:

摘要：

An occlusion device formed of a microcoil having a three-dimensional relaxed state employing open looped portions interposed between closed loop portions. Planes defined by sequentially formed open looped and closed loop portions are neither coincident nor parallel to one another.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/