Process for producing an absorbent structure comprising the following steps: providing a carrier layer； depositing and positioning absorbent material onto the carrier layer according to a pocketing pattern of absorbent material clusters with substantially no absorbent material in between the absorbent material clusters； providing an auxiliary layer covering the absorbent material so as to form a sandwich structure of the carrier layer, the auxiliary layer and the absorbent material； attaching an adhesive to the carrier layer and/or to the auxiliary layer prior to the bringing together of the sandwich structure； after the bringing together of the sandwich structure, attaching the carrier layer to the auxiliary layer to provide substantially permanent primary bonding regions and substantially detachable or temporary secondary bonding regions which are substantially free of absorbent material； said secondary bonding regions being configured to release under the swelling force of the absorbent materials and/or under the influence of water.
