Mitsuo Umemoto,Yung-Cheol Kong,Woon-Bae Kim,Pyoung-Wan Kim,Kyong-Soon Cho
申请号：
US14703833
公开号：
US10105102B2
申请日:
2015.05.04
申请国别(地区):
US
年份:
2018
代理人:
摘要：
Provided is a body-implantable package for processing biosensed-data for wireless communication to an external device. The package includes a tube closed by a cover, therein, a chip with a strained layer affixed thereto to form a flexible laminar circuit. The cover is fitted over an open end of the tube after the laminated chip and strained layer are inserted therein. The chip is constructed of and rolled in one or more turns into a generally cylindrical shape. The strained layer is affixed to a surface of the chip automatically to cause the flexible laminar circuit to curl into a generally cylindrical shape to fit within the tube.
