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ULTRASONIC DEVICE, ULTRASONIC PROBE, ULTRASONIC APPARATUS, AND ULTRASONIC DEVICE MANUFACTURING METHOD
专利权人:
Seiko Epson Corporation
发明人:
Chikara KOJIMA
申请号:
US15428479
公开号:
US20170244022A1
申请日:
2017.02.09
申请国别(地区):
US
年份:
2017
代理人:
摘要:
An ultrasonic device includes: an element substrate including an ultrasonic transducer and a first connection electrode connected to the ultrasonic transducer; a reinforcing plate that is bonded to the element substrate to reinforce the element substrate; and a second connection electrode provided on the reinforcing plate. The first and second connection electrodes are connected to each other in a bonding portion between the element substrate and the reinforcing plate.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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