Kedar G. Shah,Satinderpall S. Pannu,Vanessa Tolosa,Angela C. Tooker,Heeral J. Sheth,Sarah H. Felix,Terri L. Delima
申请号：
US14210233
公开号：
US09485873B2
申请日:
2014.03.13
申请国别(地区):
US
年份:
2016
代理人:
摘要：
Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.
