It is an object of the present invention to improve the thermal conductivity of an orthopedic fixation material made of a resin material. A fixing material for orthopedic surgery using a base material containing a resin component and a thermally conductive powder such as aluminum powder is constituted. Since the thermally conductive powder is contained, the thermal conductivity of the orthopedic fixing material is improved. By attaching a coolant or a heat-sensitive agent from above fixed on the orthopedic fixation material, it is possible to treat the affected part with cooling or warming. Furthermore, as a thermally conductive powder, if the relatively light aluminum powder is selected, the weight of the orthopedic fixation material is prevented from increasing.
