A device for cutting polyps via an endoscope lumen, including an over tube arranged to pass through an endoscope, the over tube including (1) a grasping tool arranged to be controlled from a proximal end of the endoscope and to controllably extend from a distal end of the endoscope, and (2) a cutting tool arranged to pass through the endoscope, the cutting tool arranged to be controlled from the proximal end of the endoscope and to controllably extend from the distal end of the endoscope, in which at least one of the grasping tool and the cutting tool is configured to bend away from the other one by including a pre-bent element configured to bend away when extended from the endoscope, and biased to a flat configuration when inside the endoscope, and the cutting tool is coupled to the grasping tool. Related apparatus and methods are also described.
