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Spinous process spacer
专利权人:
Michael Lee Boyer; II
发明人:
Michael Lee Boyer, II,Paul W. Millhouse,David C. Paul
申请号:
US12904515
公开号:
US08388657B2
申请日:
2010.10.14
申请国别(地区):
US
年份:
2013
代理人:
摘要:
Interspinous process implants are disclosed. An Implant is adapted and configured to be placed between adjacent spinous processes. Implant is generally H-shaped or anvil shaped with a saddle portion or central support portion extending laterally along axis between lateral end portions. End portions partially protrude beyond the front and back surfaces of support portion thereby creating a slight indentation along the front and back or anterior and posterior of central portion.
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