PROBLEM TO BE SOLVED: To provide a semiconductor device connection structure capable of improving an adhesive strength with a simple method without exerting an influence on the performance of a semiconductor element.SOLUTION: A semiconductor device connection structure 100 includes: a silicon substrate 1 which is plate-shaped and has an external connection electrode 4 thereon a support member 2 which is stuck to the rear face of the silicon substrate 1, has an adhesive plane that is a columnar shape of the substantially same shape as that of the silicon substrate 1, and has a thickness thicker than that of the silicon substrate 1 and a flexible substrate 3 having an inner lead 5 connected to the external connection electrode 4 therein. The flexible substrate 3 is arranged on the side face of the silicon substrate 1, and is stuck to the support member 2 with an adhesive 7.COPYRIGHT: (C)2014,JPO&INPIT【課題】半導体素子の性能に影響を及ぼすことなく、簡易な方法で接着強度を向上しうる半導体装置接続構造を提供する。【解決手段】本発明の半導体装置接続構造100は、板状をなし、表面に外部接続電極4を有するシリコン基板1と、シリコン基板1の裏面に接着され、接着面がシリコン基板1と略同一形状の柱状をなし、その厚さがシリコン基板1より厚い支持部材2と、内部に外部接続電極4と接続されるインナーリード5を有するフレキシブル基板3と、を備え、フレキシブル基板3はシリコン基板1の側面に配置されるとともに、フレキシブル基板3は支持部材2と接着剤7により接着されることを特徴とする。【選択図】図1
