Kedar G. Shah,Phillipe Tabada,Terri L. Delima,Satinderpall S. Pannu
申请号：
US14777332
公开号：
US20160030753A1
申请日:
2014.03.17
申请国别(地区):
US
年份:
2016
代理人:
摘要：
A hermetic electronics package of a multi-electrode neural prosthesis system includes a metal case, a feedthrough construction having an electrically insulating substrate and an array of electrically conductive feedthroughs extending through it, with the electrically insulating substrate connected to the open end of the metal case to form a hermetically sealed enclosure. And a set of electronic components is located within the hermetically sealed enclosure and operably connected to the feedthroughs of the feedthrough construction so as to electrically communicate outside the package. And a demultiplexer is fsoperatively connected to demultiplex a single signal into multiple signals prior to being transmitted through the feedthroughs.
