Alan Shi,Bernard Q. Li,Daniel D. Sorensen,Darren A. Janzig
申请号：
US13301158
公开号：
US09238093B2
申请日:
2011.11.21
申请国别(地区):
US
年份:
2016
代理人:
摘要：
The invention describes a process to remove a recast layer and/or burrs from machining processes to provide a surface of a titanium medical device without dissipation of copper or zinc from the surface of the medical device.
