A method of forming a three-dimensional conductive patch, the three-dimensional conductive patch forming a base layer coupled to one or more loop sections extending transverse o the base layer is disclosed. The method comprising forming the base fabric surface by interlacing a plurality of fibres including non-conductive fibres； forming a first segment including conductive fibres as a first portion of the three-dimensional conductive patch by interlacing a plurality of the conductive fibres transverse to the base fabric surface, the first portion interlaced with a first base fibre of the base fabric surface at one end and in a direction to an apex distanced from the base surface layer at another end of the first segment； and forming a second segment as a second portion of the three-dimensional conductive patch by interlacing a plurality of fibres including the conductive fibres extending in a direction from the apex to a second base fibre of the base surface layer； wherein the second portion is positioned relative to the first portion via the first base fibre and the second base fibre such that the first and second portions form a loop extending from the base fabric surface, the loop having the apex spaced apart from the base fabric surface, the first portion, the second portion and the base fabric surface integral with each other.L'invention concerne un procédé de formation d'un timbre conducteur tridimensionnel, le timbre conducteur tridimensionnel formant une couche de base accouplée à une ou plusieurs sections de boucle s'étendant transversalement à la couche de base. Le procédé comprend la formation de la surface de tissu de base par entrelacement d'une pluralité de fibres comprenant des fibres non conductrices ； la formation d'un premier segment comprenant des fibres conductrices en tant que première partie du timbre conducteur tridimensionnel par entrelacement d'une pluralité de fibres conductrices transversales à la surface de tissu de base, la première part
