A method of manufacturing a sensor for sensing analytes, the method including: with a dicing saw, removing material from a substrate, thereby forming an array of columnar protrusions at a first surface of the substrate； forming an insulating layer coupled to exposed surfaces of the substrate and exposed surfaces of the array of columnar protrusions； removing a portion of the insulating layer at a second surface of the substrate, directly opposed to the first surface of the substrate； with the dicing saw, removing material from a distal end of each columnar protrusion in the array of columnar protrusions, thereby defining a sharp tip, uncovered by the insulating layer, at the distal end of each columnar protrusion in the array of columnar protrusions； and coupling a conductive layer to the sharp tip of each columnar protrusion in the array of columnar protrusions.
