Remanufactured BIS sensors and methods for remanufacturing used BIS sensors are provided. Such a remanufactured sensor may include certain components from a used medical sensor and certain new components. For example, a remanufactured BIS sensor may include a backing layer and at least first, second, and third electrodes disposed on the backing layer having a conductive ink. The first, second, and third electrodes are adapted to be in electrical contact with a patient to perform BIS measurements. A foam layer may be disposed on at least a portion of the backing layer, and an adhesive may be attached to the foam layer and is configured to secure the remanufactured BIS sensor to the patient. The first electrode, the second electrode, the third electrode, the backing layer, or a combination thereof, may be new and the foam layer, the adhesive, or a combination thereof, may be from a used medical sensor.
