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The film plating process of applied chemistry reduction deposited metal what plant surface
专利权人:
发明人:
郑钧介,鄭鈞介,郑仲勋,鄭仲勛
申请号:
TW099136468
公开号:
TWI437124B
申请日:
2010.10.26
申请国别(地区):
TW
年份:
2014
代理人:
摘要:
A kind of film plating process of applied chemistry reduction deposited metal what plant surface; plant organ will predominantly be decomposed and on secured what energization jig; take second place for plant substrate is coated and is formed with a protective layer; separately using progress sensibilization on the surface of a metal stannide what plant substrate to form a sensitized surface; the silverskin of superfine particle is precipitated in sensitized surface by the reduction of reducing agent again; pass through on reducing metal ion and deposited metal material what plant substrate in order on what silverskin, most Hou rebuilds combined plant organ to constitute a plant finished product.一種應用化學還原沉積金屬於植物表面的鍍膜方法,主要為將將植物器官分解並牢固於通電治具上,次之為以一保護層對植物基材進行塗佈與定型,另使用一金屬錫化物於植物基材之表面上進行敏化作用以形成一敏化表面,再通過還原劑的還原在敏化表面析出極細粒的銀膜,俾於銀膜上通過還原金屬離子並沉積金屬材料於植物基材上,最後整修組合植物器官以構成一植物成品。
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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