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能量晶片之封存載體
专利权人:
OVERTAKE TECHNOLOGY CO.; LTD.
发明人:
HUANG, TIEN YU,黄典裕,黃典裕
申请号:
TW102203783
公开号:
TWM459873U
申请日:
2013.03.01
申请国别(地区):
TW
年份:
2013
代理人:
摘要:
A kind of object of energy chip sealed carrier up for safekeeping, be to completely cut off energy dissipation is prolonged the service life with ensuring that energy can maintain for a long time, and it includes have a carrier, an energy chipset and an encapsulated layer. Wherein, which is made of ring-side wall except around outer ring surface group, inner ring surface group and the faces group such as connect this, which has at least one or more than one accommodation groove; The what accommodation groove is arranged in the energy chip system, and provides one and stablize electric wave; On the encapsulation layer fixation what energy chipset, and the tight seal what accommodation groove.一種能量晶片之封存載體,係用以隔絕能量散失之物件,以確保能量能長期維持,延長使用壽命,其包含有一載體,一能量晶片組以及一封裝層。其中,該載體係由外環面組、內環面組以及連接該等面組周圍之外環側壁所組成,該內環面組係具有至少一個或一個以上之容置槽;該能量晶片組係設置於該容置槽,並且提供一穩定電波;該封裝層係固著於該能量晶片組之上方,且緊密密封於該容置槽。
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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