Craig Patrick Galligan,Nancy Cecelia Stoffel,Eric Patrick Davis,Kaustubh Ravindra Nagarkar
申请号：
US15902841
公开号：
US20190254546A1
申请日:
2018.02.22
申请国别(地区):
US
年份:
2019
代理人:
摘要：
The present approach relates to the fabrication of probes of a probe array device using wire bonding techniques. In certain implementation, a wire bond apparatus bonds ones end of a wire to a region of a probe array substrate. The second end, however, is not bonded to the substrate and instead is either fabricated to be vertical with respect to the substrate or raised from a non-bonded site to be vertical. The process may be repeated to form multiple probes of the probe array.
