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THERMALLY CONDUCTIVE GRAFT
专利权人:
Washington University in St. Louis;University of Washington
发明人:
Raimondo D'Ambrosio,Samuel R. Browd,John W. Miller,Jeffrey G. Ojemann,Clifford L. Eastman,Matthew Smyth,Steven M. Rothman,Jason Fender,Raimondo DAmbrosio
申请号:
US15714518
公开号:
US20180014971A1
申请日:
2017.09.25
申请国别(地区):
US
年份:
2018
代理人:
摘要:
The present disclosure provides thermally conductive grafts and methods of passively cooling a hyperthermic region and preventing epilepsy, neural inflammation, and other neurological abnormalities using a thermally conductive graft including a thermally conductive matrix disposed between two opposed surfaces.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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