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金屬銅分散液及其製造方法以及使用其形成之電極、配線圖型、塗膜、形成該塗膜之裝飾物品、抗菌性物品及彼等之製造方法
专利权人:
LTD.;ISHIHARA SANGYO KAISHA
发明人:
TOMONARI, MASANORI,IDA, KIYONOBU
申请号:
TW98129105
公开号:
TWI471168B
申请日:
2009.08.28
申请国别(地区):
TW
年份:
2015
代理人:
摘要:
Disclosed is a dispersion comprising at least metallic copper particles with gelatin provided on the surface thereof, a polymeric dispersant, and an organic solvent. The dispersion is produced by reducing copper oxide in an aqueous solvent in the presence of gelatin having an amine number and an acid number such that the difference therebetween (amine number - acid number) is 0 or less, then subjecting the reaction solution to solid-liquid separation, and then mixing the resultant metallic copper particles with gelatin provided on the surface thereof and a polymeric dispersant having an amine number and an acid number such that the difference therebetween (amine number - acid number) is 0 to 50, into an organic solvent. The dispersion can maintain dispersion stability of the metallic copper particles for a long period of time, is suitable for inkjet printing and spray coating and can be used in the formation of microelectrodes and circuit wiring patterns, for ex-ample, in printed wiring boards, and design and decoration applications utilizing a metallic tone of the coating film.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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