Matteo R. Bosisio;Gopi Soundararajan;Mohammad Reza Mehrabi
发明人:
Gopi Soundararajan,Mohammad Reza Mehrabi,Matteo R. Bosisio
申请号：
US15599762
公开号：
US20170333157A1
申请日:
2017.05.19
申请国别(地区):
US
年份:
2017
代理人:
摘要：
Apparatus and methods for removing a dental crown from a tooth. Chemical bonds within an adhesive, between the adhesive and the crown, and between the adhesive and the tooth may secure the crown to the tooth. The chemical bonds may be weakened. After weakening the bonds, the crown may not be securely affixed to the tooth. After weakening the bonds, the crown may be easily removed from the tooth. The bonds may be weakened by applying ultrasonic waves to the adhesive. Sonic energy of the waves may heat the adhesive. The bonds may be weakened by positioning the adhesive within an electric field. The bonds may be weakened by applying heat to the adhesive. The heating may cause particles within the adhesive to expand. The electric field and/or the sonic energy may be applied via an electronic tool.
