Anthony Sgroi, Jr.,Patrick Mozdzierz,Stephen Paul,David Valentine,Scott Firth
申请号：
US16270721
公开号：
US10667408B2
申请日:
2019.02.08
申请国别(地区):
US
年份:
2020
代理人:
摘要：
A method of encapsulating and hermetically sealing a printed circuit board of a flex cable includes: positioning a printed circuit board portion of a flex cable into a channel defined in a first mold half of a mold, the printed circuit board portion including a substrate and electronic components mounted on the substrate； mounting a second mold half onto the first mold half to enclose the channel of the first mold half and form a cavity within the mold； and filling the cavity of the mold with an encapsulation material through an inlet opening defined through the mold.
