Light-curing device having a thermally conductive layer (254) for dissipating heat from an LED, comprising: a body of the device (102) having a proximal end and a distal end (104), the body of the device (102) extending between the proximal end and the distal end (104) and the device body (102) including a head part (110) at the distal end (104) and a handle part (106), the head part ( 110) to support or contain an LED； a set of LEDs (120) thermally connected to the head part (110) of the body of the device (102) so that the body of the device (102) functions as a heatsink, including the set of LEDs (120) one or more LEDs and a substrate of the thermally conductive LED set (162), the one or more LEDs being electrically connected to one or more contacts (170a, 170b) in the set of LEDs (120), the one or more LEDs being configured to emit a light spectrum capable of curing a photopolymerizable composition； a thermally conductive layer (154) that thermally connects the set of LEDs (120) with the body of the device (102) and, in which a surface area that thermally connects the conductive layer (154) with the body of the device (102) ) is configured to drive a greater part of the residual heat generated by the one or more LEDs out of the set of LEDs (120) and towards the body of the device (102), which functions as a heat sink, characterized by the fact that the body of the device (102) is formed in one piece without joints of a thermally conductive body material and the handle part (106) is integral with the head part (110) extending towards the proximal end of the device body (102) , in which a thermal conductivity of the thermally conductive layer (154) is greater than a thermal conductivity of the body material of the device body (102).Dispositivo de fotopolimerización que tiene una capa térmicamente conductora (254) para disipar calor de un LED, que comprende: un cuerpo del dispositivo (102) que tiene un extremo proximal y un extremo distal (104), extendiéndose el cu
