PROBLEM TO BE SOLVED: To provide an imaging device that is small and easy to assemble, while achieving both a high pixel density and noise reduction for improved image quality.SOLUTION: The imaging device includes: an imaging element 41 a circuit board 205 connected to the imaging element 41 and having an electronic component 212 mounted thereon a plurality of signal line connections 49a formed in the circuit board 205 and to which a plurality of signal lines 108a and 108b of a composite signal cable 35 are connected and a plurality of ground signal line binding units 202a and 202b formed from a plurality of signal lines. A plurality of ground signal line connections 202a and 202b are formed in positions on different sides of the circuit board 205 where their respective ground signal binding parts 202a and 202b do not interfere with each other.COPYRIGHT: (C)2012,JPO&INPIT【課題】高画素化、及びノイズ対策を両立させて画質向上を図り、且つ小型で組立性の良い撮像装置を提供する。【解決手段】撮像装置は、撮像素子41と、撮像素子41に接続され、電子部品212が実装された回路基板205と、回路基板205に形成され、複合信号ケーブル35の複数の信号線108a,108bが接続される複数の信号線接続部49aと、複数の信号線により形成される複数のグランド信号線結束部202a,202bと、を備え、複数のグランド信号線接続部202a,202bは、回路基板205の異なる面側に夫々のグランド信号線結束部202a,202bが干渉しない位置に形成されている。【選択図】図20
