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Implantable medical device construction
专利权人:
Inc.;Medtronic
发明人:
Andrew J Ries,Terrence J Snyder,Iryna M Levina,Robert A Munoz,Eric J Wengreen,John E Lovins
申请号:
US14179795
公开号:
US09220902B2
申请日:
2014.02.13
申请国别(地区):
US
年份:
2015
代理人:
摘要:
An implantable medical device includes two conductive enclosures that are attached together, wherein the first enclosure contains electronics, and the second enclosure contains a power source. The second enclosure, all or a portion of which is located outside the first enclosure, includes an inner layer, an outer layer, and a header plate, all of which are configured to provide redundant sealing for the power source. The inner and outer layers, formed by separate metal sheets nested one within the other, are preferably in direct mechanical and electrical contact. The first sheet, which forms the inner layer, approximately conforms to a profile of the power source, located therein, and the second sheet, which forms the outer layer, conforms to a profile of the first sheet. An insulative housing, which contains connector contacts of the device, is directly secured to the first and second conductive enclosures, for example, by mounting brackets.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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