An imaging unit includes: an optical system configured to collect light； a semiconductor package including an image sensor and a sensor electrode； a plurality of electronic components； and a circuit board including: a first connection electrode provided on a front surface side of the circuit board； and an electronic component mounting area and an inspection electrode disposing area that are provided on a back surface side of the circuit board. A wall portion having a height higher than a height of the plurality of electronic components is formed at least on two facing sides around the electronic component mounting area, and a maximum thickness of the circuit board at the inspection electrode disposing area is thinner than a thickness of the circuit board including the wall portion, at the electronic component mounting area.
