您的位置: 首页 > 农业专利 > 详情页

METHOD OF ELECTROPLATING A CONVERSION ELECTRON EMITTING SOURCE ON IMPLANT
专利权人:
Suresh C. Srivastava
发明人:
Suresh C. Srivastava,Gilbert R. Gonzales,Radoslav Adzic,George E. Meinken
申请号:
US13334376
公开号:
US20120109287A1
申请日:
2011.12.22
申请国别(地区):
US
年份:
2012
代理人:
摘要:
Methods for preparing an implant coated with a conversion electron emitting source (CEES) are disclosed. The typical method includes cleaning the surface of the implant placing the implant in an activating solution comprising hydrochloric acid to activate the surface reducing the surface by H2 evolution in H2SO4 solution and placing the implant in an electroplating solution that includes ions of the CEES, HCl, H2SO4, and resorcinol, gelatin, or a combination thereof. Alternatively, before tin plating, a seed layer is formed on the surface. The electroplated CEES coating can be further protected and stabilized by annealing in a heated oven, by passivation, or by being covered with a protective film. The invention also relates to a holding device for holding an implant, wherein the device selectively prevents electrodeposition on the portions of the implant contacting the device.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
相关发明人
相关专利

意 见 箱

匿名:登录

个人用户登录

找回密码

第三方账号登录

忘记密码

个人用户注册

必须为有效邮箱
6~16位数字与字母组合
6~16位数字与字母组合
请输入正确的手机号码

信息补充