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EMBALLAGE TRIDIMENSIONNEL POUR IMPLANTS MEDICAUX
专利权人:
MEDOS INTERNATIONAL SARL
发明人:
HOGG, ANDREAS,TARDY, YANIK,AELLEN, THIERRY,KEPPNER, HERBERT,BURGER, JUERGEN
申请号:
CA2817328
公开号:
CA2817328A1
申请日:
2013.05.29
申请国别(地区):
CA
年份:
2013
代理人:
摘要:
Implantable medical devices, and methods of coating same, including aplurality of componentsdisposed on a substrate, and a low surface energy layer deposited as a liquidover at least a firstportion of the components and the substrate, the low surface energy layerbecoming solidifiedafter deposition and conforming to at least the first portion of thecomponents. The devicesfurther include a biocompatible hermetic coating conforming to and sealinglycovering at least aportion of the low surface energy layer.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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