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SOUDAGE PAR LASER D'UNE CONNEXION D'INTERFACE
专利权人:
Heraeus Deutschland GmbH & Co. KG
发明人:
申请号:
EP14717329.8
公开号:
EP2968956B1
申请日:
2014.03.13
申请国别(地区):
EP
年份:
2017
代理人:
摘要:
One aspect is a feedthrough for a medical implantable device including a ferrule having a metal that is configured to be welded to a case of the implantable device. The ferrule substantially surrounds an insulator and shares an interface therewith, the insulator having a glass or ceramic material. Conductive elements are formed through the insulator providing an electrically conductive path through the insulator. There is no braze or solder at the interface between the ferrule and the insulator and that there is no braze or solder adjacent the conductive elements.
来源网站:
中国工程科技知识中心
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http://www.ckcest.cn/home/

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