Steven Deininger,Jeffrey Clayton,Michael Baade,Anthony Chasensky
申请号：
US16273133
公开号：
US20200254263A1
申请日:
2019.02.11
申请国别(地区):
US
年份:
2020
代理人:
摘要：
Implantable medical devices include circuitry positioned adjacent to header-related structures, rather than having the header and related structures sitting atop the position of the circuitry within a device housing. A circuit board within the device housing may be positioned adjacently to a lead bore of the header. Feedthrough conductors may extend from the circuitry to conductors of the header while being positioned adjacently to the circuit board. Lead frame conductors may extend to the electrical connectors of the lead bores while also being adjacent to the upper portion of the circuitry. Device height may be reduced by having the circuitry be positioned adjacent to one or more of the various header-related structures.
