Provided a mounting structure manufacturing method, a mounting jig, a mounting structure manufacturing apparatus, an imaging apparatus, and an endoscope apparatus that can easily manufacture a mounting structure in which pins and other electronic components are mounted on the same surface. To do. The mounting structure manufacturing method of the present invention is a mounting structure manufacturing method in which a plurality of pins and a plurality of electronic components are connected to the same surface of a substrate, and the plurality of pins and the plurality of electronic components are aligned. Setting step (step S1), and arranging the plurality of aligned pins and the plurality of electronic components on the stage of the mounting apparatus, and lowering the head portion of the mounting apparatus that has attracted the substrate, A connecting step (step S4) of collectively connecting the pins and the electronic components to the surface of the substrate by heating and pressing in a state where the solder applied in advance and the connecting portion of the pins are in contact with each other. It is characterized by that.ピンと他の電子部品とが同一面に実装された実装構造体を簡易に製造可能な実装構造体の製造方法、実装用治具、実装構造体の製造装置、撮像装置および内視鏡装置を提供する。本発明の実装構造体の製造方法は、複数のピンと複数の電子部品とが基板の同一面に接続された実装構造体の製造方法であって、前記複数のピンと複数の電子部品とを整列させてセットするセット工程（ステップＳ１）と、前記整列させた複数のピンおよび複数の電子部品を実装装置のステージに配置し、前記基板を吸着した実装装置のヘッド部を降下して、基板のランドに予め塗布された半田と前記ピンの接続部が接した状態で、加熱および加圧して前記ピンおよび前記電子部品とを前記基板表面に一括して接続する接続工程（ステップＳ４）と、を含むことを特徴とする。
