Dick Scholten,Michael Stumber,Franz Laermer,Ando Feyh
申请号：
US12925804
公开号：
US08986256B2
申请日:
2010.10.29
申请国别(地区):
US
年份:
2015
代理人:
摘要：
A manufacturing method for a porous microneedle array includes: forming a plurality of porous microneedle arrays, each having at least one microneedle and a porous carrier zone lying beneath it on the face of a semiconductor substrate forming an interlayer between a non-porous residual layer of the semiconductor substrate located on the back side of the semiconductor substrate and the carrier zone, which has greater porosity than the carrier zone detaching the residual layer from the carrier zone by breaking up the interlayer and separating the microneedle arrays into corresponding chips.
