An imaging catheter assembly is provided. The imaging catheter assembly includes an interposer including a multi-layered substrate structure, wherein the multi-layered substrate structure includes a first plurality of conductive contact pads coupled to a second plurality of conductive contact pads via a plurality of conductive lines； an imaging component coupled to the interposer via the first plurality of conductive contact pads； and an electrical cable coupled to the interposer via the second plurality of conductive contact pads and in communication with the imaging component.
