Craig Allen Powell,Richard George Coe,Richard James Wadman,Rong Deng
申请号：
US14135687
公开号：
US20150173961A1
申请日:
2013.12.20
申请国别(地区):
US
年份:
2015
代理人:
摘要：
The present disclosure relates to methods and apparatuses for mechanically bonding substrates together. The apparatus comprises a bonding roll comprising a base surface and plurality of nubs extending from the base surface, each of the plurality of nubs comprising: a sidewall； a bonding surface； and a shoulder connecting the sidewall to the bonding surface. The shoulder comprises a single chamfer or a radius to, inter alia, reduce tearing of the substrates.
