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ULTRASOUND TRANSDUCER AND METHOD FOR WAFER LEVEL FRONT FACE ATTACHMENT
专利权人:
General Electric Company
发明人:
Flavien Daloz,Philippe Menage,Edouard Da Cruz,Jean Pierre Malacrida,Giandonato Stallone,Coraly Cuminatto
申请号:
US15385620
公开号:
US20180169701A1
申请日:
2016.12.20
申请国别(地区):
US
年份:
2018
代理人:
摘要:
Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises: a piezoelectric layer, a matching layer, one surface of the matching layer is electrically coupled to a top surface of the piezoelectric layer and another surface of the matching layer forms a signal pad within a front face of the ultrasound transducer, and a base package electrically coupled to a bottom surface of the piezoelectric layer, the base package extending horizontally and laterally to form a back face of the ultrasound transducer parallel to the front face of the ultrasound transducer, and extending vertically relative to the back face of the ultrasound transducer to form a ground pad within the front face of the ultrasound transducer. In this way, the transducer can work robustly and may be automatically mounted to a flat substrate with printed circuit.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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