An electronic waste processing apparatus has a power supply device, a vacuum cracking device, a filter device, and a separation device. The vacuum device is electrically connected to the power supply device, and has a vacuum pump, a vacuum chamber, and a high-frequency furnace body. The vacuum chamber is connected to and communicates with the vacuum pump. The high-frequency furnace body is disposed in the vacuum chamber. The filter device is electrically connected to the power supply device, and is connected to and communicates with the high-frequency furnace body of the vacuum cracking device. The separation device is electrically connected to the power supply device, is connected to and communicates with the vacuum pump and the filter device, and has a condensation cylinder, a cooling cylinder, and an oil storage tank.
