Disclosed herein is a method of assembling an implantable medical lead configured to receive a stylet. The lead is provided with a tubular insulation layer, an electrode is disposed on the tubular insulation layer, an electrical conductor is routed through the tubular insulation layer, and a stylet stop is inserted into a distal end of the tubular insulation layer. The electrical conductor is directly and mechanically connected to the stylet stop and is in electrical communication with the electrode.
