您的位置: 首页 > 农业专利 > 详情页

THERMAL CONDUCTIVE LAYER FOR TRANSDUCER FACE TEMPERATURE REDUCTION
专利权人:
FUJIFILM SONOSITE; INC.
发明人:
Wei Li,Keith Williams
申请号:
US16226415
公开号:
US20200196992A1
申请日:
2018.12.19
申请国别(地区):
US
年份:
2020
代理人:
摘要:
A method and apparatus are disclosed herein for a thermally conductive layer for transducer face temperature reduction in an ultrasound transducer assembly. In one embodiment, the ultrasound transducer assembly comprises: a transducer layer configured to emit ultrasound energy; one or more matching layers overlaying the transducer layer; a thermally conductive layer overlaying the one or more matching layers; and a lens overlaying the thermally conductive layer.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

意 见 箱

匿名:登录

个人用户登录

找回密码

第三方账号登录

忘记密码

个人用户注册

必须为有效邮箱
6~16位数字与字母组合
6~16位数字与字母组合
请输入正确的手机号码

信息补充