MULTILAYER COMPOSITE MATERIAL VIAS

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专利权人:

发明人:

Jerry Ok,Alfred E. Mann

申请号：

US15979173

公开号：

US20180256307A1

申请日:

2018.05.14

申请国别(地区):

US

年份:

2018

代理人:

摘要：

Novel multilayer composite material vias for biological implants are disclosed. The vias comprise two metals, so that the metal more compatible with biological environments is on one end of the via, and the metal more compatible with fabrication of a hermetic package is on the other end of the via.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/