PROBLEM TO BE SOLVED: To prevent stress generation in a support substrate by contraction of a sealant.SOLUTION: A first sealant 46 is filled in the periphery of a sticking face between a sensor panel 23 and a scintillator panel 24 such that the first sealant 46 does not come into contact with the support substrate 33 of the scintillator panel 24. A second sealant 47 having a smaller contraction coefficient in hardening than the first sealant 46 is filled between an eaves-shaped part 33a of the support substrate 33 and the sensor panel 23 outside the first sealant 46. The upper face of the sensor panel 23 is provided with a first flow stop part 48 and a second flow stop part 49 for blocking flowage of the sealants so as to fill the sealants without a gap to an inner part inside a narrow region sandwiched by the eaves-shaped part 33a and the sensor panel 23.COPYRIGHT: (C)2013,JPO&INPIT【課題】封止剤の収縮による支持基板への応力発生を防止する。【解決手段】センサパネル23とシンチレータパネル24との貼り合せ面の外周に、シンチレータパネル24の支持基板33に接触しないように第1の封止剤46を充填する。また、支持基板33の庇状部33aとセンサパネル23との間で第1の封止材46の外側に、第1の封止剤46よりも硬化時の収縮率が小さな第2の封止剤47を充填する。庇状部33aとセンサパネル23とで挟まれた狭い領域内の奥間で隙間なく封止剤を充填できるようにするため、センサパネル23の上面に、封止剤の流動を阻止するための第1の流止め部48及び第2の流止め部49を設ける。【選択図】図3
