An essentially halogen-free, plasticizer-free thermoplastic elastomer compound is disclosed. The compound has from 10-80 weight percent of a hydrogenated styrene butadiene copolymer having a styrene content of less than 20 weight percent from 20 - 90 weight percent of a polyolefm and less than about 3 weight percent of antioxidant. The compound is capable of being solvent bonded or welded to another thermoplastic material using cyclohexanone alone or with methyl ethyl ketone. The compound is especially useful as medical tubing connected to other parts of medical equipment. The bond strength of the compound to the other thermoplastic material is properly determined only after multiple days of bonding.
