A HOUSING FOR A CIRCUIT THAT IS TO BE IMPLANTED IN-VIVO AND PROCESS OF MAKING THE SAME

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专利权人:

发明人:

申请号：

HK11105731.0

公开号：

HK1152193A

申请日:

2007.01.12

申请国别(地区):

HK

年份:

2012

代理人:

摘要：

The present invention provides a biocompatible circuit assembly that includes a circuit encased within a housing. In some embodiments, the housing is a PMMA housing and before the circuit is enclosed within the housing the circuit is encased within a brick of epoxy.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/