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METHODS AND SYSTEMS USING MOLECULAR GLUE FOR COVALENT BONDING OF SOLID SUBSTRATES
专利权人:
HI LLC
发明人:
Sukanta Bhattacharyya,Daniel Sobek
申请号:
US16573524
公开号:
US20200123416A1
申请日:
2019.09.17
申请国别(地区):
US
年份:
2020
代理人:
摘要:
A method for bonding together two substrates includes providing a molecular glue including glue molecules, each of the glue molecules having at least two —;O—;Si or —;O—;Al moieties; reacting a surface of a first substrate with the molecular glue to attach the glue molecules to the surface of the first substrate by at least one of the —;O—;Si or —;O—;Al moieties; and reacting a surface of a second substrate with the molecular glue to attach the glue molecules to the surface of the second substrate by at least another one of the —;O—;Si or —;O—;Al moieties. The method can be used for a variety of applications including manufacturing a vapor cell.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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