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Sensor over-mold shape
专利权人:
Daniel S. Flo
发明人:
Daniel S. Flo,James K. Carney,Kamal Deep Mothilal,Jon D. Schell
申请号:
US13362270
公开号:
US09131858B2
申请日:
2012.01.31
申请国别(地区):
US
年份:
2015
代理人:
摘要:
An implantable sensor module includes a housing having an inner shell and an outer layer formed to extend over and enclose the inner shell to form an outer wall of the housing, the inner shell having a thickness extending between an inner wall of the inner shell and an outer wall of the inner shell, the outer layer having an inner side engaged against the outer wall of the inner shell and having a thickness extending between the inner side and the outer wall of the housing, wherein the inner shell and the outer layer form a substantially flat portion. A flexible diaphragm is formed within the inner shell and extends between a first edge and a second edge, and a shoulder extends adjacent to the first edge to extend the outer layer laterally away from a central medial line extending between the first and second edges of the diaphragm.
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中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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