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METHODS TO GENERATE ELONGATED WIRES HAVING A METALLIC SUBSTRATE THEREON AND DEVICES COMPRISING THE SAME
专利权人:
3DT Holdings; LLC
发明人:
Ghassan S. Kassab,Zachary Berwick,Matthew J. Phillips,Peter J. D'Aquanni,Peter J. DAquanni
申请号:
US15714187
公开号:
US20180019039A1
申请日:
2017.09.25
申请国别(地区):
US
年份:
2018
代理人:
摘要:
Methods to generate elongated wires having a metallic substrate thereon and devices comprising the same. In a method of generating a device, the method comprises the steps of applying a first nonconductive coating upon an elongated core body of the device; applying a first conductive coating upon the first nonconductive coating; applying a photoresist coating upon the first conductive coating; directing a laser/light from a laser/light source upon portions of the photoresist coating to cause said portions of the photoresist coating to harden; applying a first chemical to the photoresist coating to remove the photoresist coating that was not hardened by the laser/light; and applying a second chemical to the hardened photoresist coating to expose portions of the first conductive coating previously positioned below the hardened photoresist coating.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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