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Electrostatic-bonding-type vesicle including metal microparticles
专利权人:
The University of Tokyo;Teijin Limited
发明人:
Kataoka, Kazunori,Kishimura, Akihiro,Anraku, Yasutaka,Sakai, Mitsuru,Ota, Hideo,Kondo, Shiro,Momose, Miho
申请号:
AU2013330729
公开号:
AU2013330729A1
申请日:
2013.10.11
申请国别(地区):
AU
年份:
2015
代理人:
摘要:
A vesicle including metal microparticles, the vesicle configured having a membrane formed by a first polymer of (a) or (b) and a second polymer of (c) or (d) (the combination of (b) and (d) being excluded), a portion of a cationic segment and an anionic segment in the polymers being cross-linked in the membrane. First polymer: (a) a block copolymer (I) having a non-charged hydrophilic segment and a cationic segment, (b) an amino acid polymer (I) having a cationic segment; Second polymer: (c) a block copolymer (II) having a non-charged hydrophilic segment and an anionic segment, (d) an amino acid polymer (II) having an anionic segment.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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