WU, Xiaosong,HIMMELBERGER, Daniel W.,CHOPIN, III. Lamy J.
申请号：
EP20160730546
公开号：
EP3303496(A1)
申请日:
2016.05.17
申请国别(地区):
欧洲专利局
年份:
2018
代理人:
摘要：
The present disclosure provides a composition. In an embodiment, the composition includes: A) an ethylene/a-olefin multi-block copolymer having a melt index from 0.2 g/10 min to 8.0 g/10 min; B) a styrenic block polymer comprising from greater than 1 wt% to less that 50 wt% units of polymerized styrene; C) a tackifier; D) an oil; and the composition has a melt index from 3 g/10 min to 50 g/10 min. The composition is suitable for use as a pressure sensitive adhesive layer in a reclosable packaging structure.
